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video camera ic 1 publication date: february 2003 sdb00057bem MN3114 vertical driver (8 channels) for ccd area image sensors overview the MN3114 is an 8-channel vertical driver for two- dimensional interline ccd area image sensors that also integrates a single sub driver channel on the same chip. adoption of this ic can reduce both power consump- tion and parts counts in end products. features ? vertical driver block: consists of level shifters and 2-value/3-value output driver circuits. ? sub driver block: consists of a level shifter and a 2-value output driver circuit. ? package: 24-pin ssop applications ? digital still cameras, video cameras (top view) 1 2 3 4 5 6 7 8 9 10 11 12 osub vl ov8 ov4 ov1 ov5 (n.c.) vdc ch3 iv1 ch1 iv4 24 23 22 21 20 19 18 17 16 15 14 13 vhh ov6 ov2 vm ov3 ov7 vh ch4 iv3 ch2 iv2 isub
MN3114 video camera ic 2 sdb00057bem block diagram vhh 24 osub 1 ov6 23 vl 2 ov2 22 ov8 3-value driver 3 vm 21 ov4 4 ov3 20 ov1 5 ov7 19 ov5 6 vh 18 n.c. 7 ch4 17 vdc 8 iv3 16 ch3 9 ch2 15 iv1 10 iv2 14 ch1 11 isub 13 iv4 12 3-value driver level shifter level shifter level shifter level shifter 3-value driver 3-value driver level shifter level shifter level shifter level shifter level shifter note) vdc, vl, and vm: common power supply vhh and vh: sub driver block and vertical driver 3-value independent power supply
video camera ic MN3114 3 sdb00057bem pin descriptions pin no. pin name i/o description 8 vdc input block i low-voltage system high-level input high-level supply voltage 18 vh vertical driver block i high-voltage system high-level input high-level supply voltage 24 vhh sub driver block i high-voltage system high-level input high-level supply voltage 21 vm middle-level supply voltage i high-voltage system middle-level input 2 vl low-level supply voltage i high-voltage system low-level input 10 iv1 transfer pulse input i charge transfer pulse input 14 iv2 transfer pulse input i charge transfer pulse input 16 iv3 transfer pulse input i charge transfer pulse input 12 iv4 transfer pulse input i charge transfer pulse input 11 ch1 charge pulse input i charge readout pulse input 15 ch2 charge pulse input i charge readout pulse input 9 ch3 charge pulse input i charge readout pulse input 17 ch4 charge pulse input i charge readout pulse input 13 isub sub pulse input i unneeded charge sweep-out pulse input 5 ov1 3-value transfer pulse o 3-value transfer pulse output output (vh, vm, or vl) 22 ov2 2-value transfer pulse o 2-value transfer pulse output output (vm or vl) 20 ov3 3-value transfer pulse o 3-value transfer pulse output output (vh, vm, or vl) 4 ov4 2-value transfer pulse o 2-value transfer pulse output output (vm or vl) 6 ov5 3-value transfer pulse o 3-value transfer pulse output output (vh, vm, or vl) 23 ov6 2-value transfer pulse o 2-value transfer pulse output output (vm or vl) 19 ov7 3-value transfer pulse o 3-value transfer pulse output output (vh, vm, or vl) 3 ov8 2-value transfer pulse o 2-value transfer pulse output output (vm or vl) 1 osub sub pulse output o unneeded charge sweep-out pulse output (vhh or vl) 7 n.c. ?
MN3114 video camera ic 4 sdb00057bem operating mode table 1. 2-value transfer pulse (vertical driver block) iv2 ov2, ov6 iv4 ov4, ov8 high low low mid 2. 3-value transfer pulse ch1 iv1 ov1 ch2 iv3 ov3 ch3 iv1 ov5 ch4 iv3 ov7 high high low low mid low high low low high note) iv1, iv2, iv3, iv4, ch1, ch2 high: vdc low: gnd ov1, ov2, ov3, ov4, ov5, ov6, ov7, ov8 high: vh mid: vm low: vl 3. unneeded charge sweep-out pulse (sub driver block) isub osub high low low high note) isub high: vdc low: gnd osub high: vhh low: vl
video camera ic MN3114 5 sdb00057bem timing charts 1. 2-value transfer pulse 2. 2-value transfer pulse 3. 3-value transfer pulse 4. 3-value transfer pulse 5. sub pulse iv2 ov2, ov6 high low mid low iv4 ov4, ov8 high low mid low iv1 high low ch1 high low ch3 high low ov1 high mid low ov5 high mid low iv3 ch2 ch4 ov3 ov7 high low high low high low high mid low high mid low isub osub high low high low
MN3114 video camera ic 6 sdb00057bem electrical characteristics 1. absolute maximum ratings parameter symbol rating unit supply voltage 1 vhh-vl 27 v supply voltage 2 vh-vl 27 v supply voltage 3 vm vl to 6 v supply voltage 4 vdc 0 to 5.5 v negative supply voltage vl ? 8.5 to 0 v input voltage vi vl ? 0.3 to vdc + 0.3 v input and output clamp diode current iic, ioc 10 ma maximum dc load current iodc 3ma maximum load capacitance cl 5 500 pf/pin power dissipation * pd 260 mw operating temperature topr ? 20 to + 75 c storage temperature tstg ? 50 to + 125 c note) 1. the absolute maximum ratings are limit values for stresses applied to the chip so that the chip will not be destroyed. operation is not guaranteed within these ranges. 2. * : four-layers glass epoxy board. (maximum t a = 75 c) 3. dc characteristics at vhh = 15.0 v, vh = 15.0 v, vl = ? 7.5 v, vdc = 2.7 v to 3.6 v, t a = ? 20c to +75c parameter symbol condition min typ max unit quiescent supply current iddst vhh, vh, vm, vl, vdc ?? 10 a total vi = vdc operating supply current ivhhdddyn refer to test conditions, ?? 0.5 ma ivhdddyn 2. input pulse timing ?? 0.5 ivmdddyn chart and 3. load circuit ?? 8 ivldddyn connection diagram. ?? 8.5 ivdcdddyn vi = gnd, vdc ?? 1 1) input pins: iv1, iv2, iv3, iv4, ch1, ch2, ch3, ch4, isub high-level voltage vih vdc 0.7 ? vdc v low-level voltage vil 0.0 ? vdc 0.3 v input leakage current iilk vi = 0 to vdc ? 1.0 ? 1.0 a 2. operating conditions at t a = ? 20c to +75c parameter symbol condition min typ max unit negative supply voltage vl ? 8.5 ?? 4v supply voltage 1 vdc 2.7 ? 5.5 v supply voltage 2 vhh 11.5 ? 18.5 v supply voltage 3 vh 11.5 ? 18.5 v supply voltage 4 vm ? 2 ? 2v input frequency fin ?? 500 khz
video camera ic MN3114 7 sdb00057bem electrical characteristics (continued) 3. dc characteristics (continued) at vhh = 15.0 v, vh = 15.0 v, vl = ? 7.5 v, vdc = 2.7 v to 3.6 v, t a = ? 20c to +75c parameter symbol condition min typ max unit 2) output pins 1 (2-value output) : ov2, ov4, ov6, ov8 mid-level output voltage vom1 iom1 = ? 1 ma ? 0.1 ? vm v low-level output voltage vol1 iol1 = 1 ma vl ?? 7.4 v mid-level output on resistance ronm1 iom1 = ? 10 ma ?? 40 ? low-level output on resistance ronl1 iol1 = 10 ma ?? 30 ? 3) output pins 2 (3-value output) : ov1, ov3, ov5, ov7 high-level output voltage voh2 ioh2 = 1 ma 14.9 ? vh v mid-level output voltage vom2 iom2 = 1 ma ? 0.1 ? vm v low-level output voltage vol2 iol2 = 1 ma vl ?? 7.4 v output on resistance (high level) ronh2 ioh2 = 10 ma ?? 40 ? output on resistance (mid level) ronm2 iom2 = 10 ma ?? 30 ? output on resistance (low level) ronl2 iol2 = 10 ma ?? 30 ? 4) output pins 3 (sub output) : osub high-level output voltage vohh3 iohh3 = ? 1 ma 14.9 ? vhh v low-level output voltage vol3 iol3 = 1 ma vl ?? 7.4 v output on resistance (high level) ronhh3 ionhh3 = ? 10 ma ?? 40 ? output on resistance (low level) ronl3 iol3 = 10 ma ?? 30 ? 4. ac characteristics at vhh = 15.0 v, vh = 15.0 v, vl = ? 7.5 v, vdc = 2.7 v to 3.6 v, t a = ? 20c to +75c parameter symbol condition min typ max unit 1) output pins 1 (2-value output) : ov2, ov4, ov6, ov8 transmission delay time tplm no load ? 100 200 ns tpml rise time ttlm load circuit ? 200 400 ns fall time ttml 2) output pins 2 (3-value output) : ov1, ov3, ov5, ov7 transmission delay time tplm no load ? 100 200 ns tpml tpmh ? 100 200 tphm rise time ttlm load circuit ? 200 400 ns fall time ttml ttmh ? 200 400 tthm 3) output pins 3 (sub output) : osub transmission delay time tplhh no load ? 100 200 ns tphhl rise time ttlhh ? 200 400 ns fall time tthhl
MN3114 video camera ic 8 sdb00057bem test conditions 1. transmission delay time, rise time, and fall time input iv1, iv2, iv3, iv4, (isub) 90% tf * tr * ttlm (ttlhh) ttml (tthhl) 50% 10% vdc gnd output ov1, ov2, ov3, ov4, ov5, ov6, ov7, ov8, (osub) 90% tplm (tplhh) tpml (tphhl) 50% 10% vom (vohh) vol (vol) input ch1, ch2, ch3, ch4 90% tf * tr * ttmh tthm 50% 10% vdc gnd output ov1, ov3, ov5, ov7 90% tpmh tphm 50% 10% voh vom note) * : tr = tf = 20 ns (typ.)
video camera ic MN3114 9 sdb00057bem test conditions (continued) 2. input pulse timing chart ch4 ch3 ch2 ch1 iv4 iv3 iv2 iv1
MN3114 video camera ic 10 sdb00057bem test conditions (continued) 3. load circuit connection diagram usage notes 1. if the sub driver is not used: 1) connect vhh to vh. 2) connect isub to vdc. 3) leave osub (pin 1) open. 2. connect bypass condensers to the MN3114 power supply pins vhh, vh, vm, vl, and vdc. locate these bypass condensers as close to the ic as possible. 3. guarantee period after opening the sealed packing: the guarantee period after opening the sealed desiccated packing is three weeks under environment temperature and humidity conditions of 30 c and 70% rh. 4. the recommended reflow temperature is 230 c. osub osub c1: 3 300 pf c2: 560 pf c3: 2 700 pf r1: 30 ? r2: 10 ? c3 ov7 ov2 r1 r1 ov6 ov3 ov5 ov4 r1 r1 c2 r1 r1 ov8 ov1 c2 c2 c2 c2 c2 c2 c2 c2 c2 c2 c2 c2 c2 c2 c2 c2 c2 r2 c2 c1 c2 r1 r1 c2 c2 c2 c2 c2 c2 c1 c1 c1 c1 c1 c1 c1 c2 c2
video camera ic MN3114 11 sdb00057bem application circuit example vh 1 f 1 m ? 100 k ? 1 000 pf vdc from timing generator note) connect bypass condensers to the MN3114 power supply pins vhh, vh, vm, vl, and vdc. locate these bypass condensers as close to the ic as possible. v1 v2 v3 v4 v5 v6 v7 v8 ccd sub pt 0.1 f vm vhh vl vhh 24 osub 1 ov6 23 vl 2 ov2 22 ov8 3-value driver 3 21 ov4 4 ov3 20 ov1 5 ov7 19 ov5 6 vh 18 n.c. 7 ch4 17 vdc 8 iv3 16 ch3 9 ch2 15 iv1 10 iv2 14 ch1 11 isub 13 iv4 12 3-value driver level shifter level shifter level shifter level shifter 3-value driver 3-value driver level shifter level shifter level shifter level shifter level shifter
MN3114 video camera ic 12 sdb00057bem package dimensions (unit: mm) ? ssop024-p-0300c (lead-free package) 0 to 10 13 0.15 +0.10 - 0.05 24 12 1 1.00 0.20 6.50 0.20 (0.50) seating plane seating plane 0.20 +0.10 - 0.05 5.50 0.20 7.50 0.20 0.10 0.10 1.50 0.20 1.60 0.30 0.50 0.20 0.50
request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteris- tics and applied circuits examples of the products. it neither warrants non-infringement of intellec- tual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) the products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instru- ments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this material are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage, and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2002 jul

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